 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| TECHNICAL NOTE Sound Path Selector IC Series for Mobile Phones Mixer & Selector with PCM CODEC and 16bit D/A Converter BU7861KN Abstract The "In/Output Selector with Built-in PCM Codec 16bit D/A Converter" LSI is ideal for improving the sound quality of and miniaturizing cellular phone handsets with music playback function, accumulating analog circuits for sound which application CPUs and bass band LSIs are not ideally able to handle. Features 1) Loaded with stereo 16bit audio D/A converter 2) Compatible with stereo and analog interfaces 3) Built-in stereo headphone amp (16) 4) Lowpass correction circuit built into the headphone amp 5) Gain-adjustable volume built in 6) Flexible mixing function built in Uses Portable information communication devices such as cellular phone handsets and PDA (Personal Digital Assistants) Cellular phone handsets with music playback function Absolute Maximum rating Parameter Supply Voltage Power Dissipation Operational Temperature Range Symbol DVDD AVDD, PVDD Pd TOPR rating -0.3 4.5 500 *1 -25 +80 Unit V mW -55 +125 Storage Temperature Range TSTG *1 When used at over Ta=25, lessen by 5.0mW per 1 increase. Recommended Operational Range Parameter Digital Supply Voltage Analog Supply Voltage Power Supply Voltage PLL Synchronous Signal Frequency Symbol DVDD AVDD PVDD FSYNC Min. 2.7 2.7 2.7 Typ. 3.0 3.0 3.0 8 Max. 3.3 3.3 3.3 Unit V V V kHz Sep. 2008 Electrical Characteristics (Unless specified, Ta=25, DVDD=AVDD=3.0V, PVDD=3.0V, FSYNC=8kHz) Complete Block Parameter Consumed Current 1 Consumed Current 2 Consumed Current 3 Consumed Current 4 Consumed Current 5 Consumed Current 6 Consumed Current 7 Consumed Current 8 Consumed Current 9 Consumed Current 10 Consumed Current 11 Consumed Current 12 Digital High Level Input Voltage Digital Low Level Input Voltage Digital High Level Input Current Digital Low Level Input Current Digital High Level Output Voltage Digital Low Level Output Voltage Schmidt Input Hysteresis Width Sound Block Parameter Frequency Characteristics DAC Full Scale Gain Error between Channels Distortion (No Bass Boost) Distortion (With Bass Boost) S/N Crosstalk Output Level during Mute Symbol IDD1 IDD2 IDD3 IDD4 IDD5 IDD6 IDD7 IDD8 IDD9 IDD10 IDD11 IDD12 VIH VIL IIH IIL VOH VOL Vhys Min. 0.8x DVDD -10 DVDD 0.5 0.3 Typ. 0.1 0.8 1.7 1.6 1.0 5.9 6.4 2.2 2.9 2.2 10.0 18.0 0.5 Max. 10 1.2 2.6 2.4 1.5 9.0 9.6 3.3 4.5 3.3 15.0 27.0 0.2x DVDD 10 0.5 0.7 Unit A mA mA mA mA mA mA mA mA mA mA mA V V A A V V V Conditions When all power down, FSYNC L fixed REFON, FSYNC L fixed REFON+PLLON, FSYNC=8kHz REFON+MICBON, FSYNC L fixed REFON+EXTOUT, FSYNC L fixed REFON+PLLON+VICON, FSYNC=8kHz REFON+PLLON+VICON+TONEON, FSYNC=8kHz REFON+RECON, FSYNC L fixed REFON+HPON, FSYNC L fixed REFON+ HPVOLON, FSYNC L fixed DACON, SYSCLK=256fs All power on FSYNC=8kHz SYSCLK=256fs VIH=DVDD VIL=0V IOH=1mA IOL=1mA SYSCLK, BCLK, LRCLK, FSYNC, DSPCLK Min. -3 1.4 Typ. 1.8 Max. +3 2.2 1.5 1 10 Unit dB VP-P dB % % dB dB dB Conditions Reference level (-20dB due to full scale) f=20Hz20kHz -3dB band width 0.6xVDD Difference between Lch and Rch levels during DAC full scale DAC input=-0.5dBFS, HP_VOL=-2dB, HP2_VOL=0dB DAC input=-0.5dBFS, HP_VOL=-2dB, HP2_VOL=0dB During full scale HP_VOL, HP2_VOL=0dB, f=1kHz, A-weighted Stereo headphone amp included Measures the leak from Lch to Rch during full-scale output. 1kHz BPF kHz BPF 75 70 70 83 80 80 2/12 Driver Amp Block Parameter Gain Configurable Range (THD1%) Maximum Output Voltage (THD 1%) S/N 100Hz PSRR 1kHz Load Maximum Output PowerTHD 1% S/N Offset Voltage 100Hz PSRR 1kHz Load Maximum Output PowerTHD 1% 100Hz PSRR 1kHz Maximum Output Voltage (THD 1%) Maximum Output Voltage (THD 1%) Parameter MICIN DSPOUT EXTIN DSPOUT DSPIN RECP DSPIN SPOUT DSPIN EXTOUT EXTIN RECN EXTIN SPOUT -45dBm0 -40dBm0 0, -30dBm0 -45dBm0 -40dBm0 0, -30dBm0 -55dBm0 -50dBm0 0, -40dBm0 -55dBm0 -50dBm0 0, -40dBm0 0.06kHz 0.2kHz 0.33.0kHz 3.4kHz 3.6kHz 3.78kHz 0.33.0kHz 3.4kHz 3.6kHz Min. 0.44 Min. 40 60 12 25 26 31.25 80 65 60 12 15 15 40 0.707 0.707 Typ. 1.0 66 20 35 32 45 90 5 77 70 16 25 26 48 Max. 100 Unit Vrms dB Vrms Vrms Unit dB Vrms dB dB mW dB mV dB mW RL=16, f=1kHz 0.2VP-P superimposed to supply COMIN 1.0F, HP_Vol=0dB RL=10k, f=1kHz RL=3k, f=1kHz RL=32, f=1kHz RL=32, C-Message 0.2VP-P superimposed supply COMIN 1.0F to Conditions f=100Hz3.4kHz MICO terminal, f=1kHz C-Message 0.2VP-P superimposed to supply COMIN 1.0F, MICIN no input Microphone Amp Receiver Amp Stereo Headphone Amp SPOUT Terminal EXTOUT Terminal Codec Block Typ. 0.50 Max. 0.56 Transmitting Side Reference Input Level 0.119 0.44 0.44 0.44 2.4 2.4 24 29 35 24 29 35 -0.9 -0.6 -0.3 -0.9 -0.6 -0.3 24 0 -0.3 -0.3 0 6.5 -0.3 -0.3 0.0 0.135 0.50 0.50 0.50 3.2 3.2 3/12 0.151 0.56 0.56 0.56 4.0 4.0 0.9 0.6 0.3 0.9 0.6 0.3 2.5 0.3 0.9 0.5 0.9 Vrms Vrms Vrms Vrms dB dB dB Receiving Side Reference Input Level Pass Gain Transmitter Signal vs. General Power Distortion MICINDSPOUT Receiver Signal vs. General Power Distortion DSPINRECP Transmitter Transmission Level MICINDSPOUT Receiver Transmission Level DSPINRECP Conditions When 1020Hz, sine wave, 0dBm0 transmitting MIC amp gain 0dB, Tx_Vol 0dB When 1020Hz, sine wave, 0dBm0 transmitting Amp gain 11.37dB, Tx_Vol 0dB At 1020Hz, sine wave, 0dBm0 input Rx_Vol 0dB At 1020Hz, sine wave, 0dBm0 input Rx_Vol 0dB At 1020Hz, sine wave, 0dBm0 input Rx_Vol 0dB EXTIN input, Rx_testline path Rx_Vol 0dB EXTIN input, Rx_testline path SPRX_Vol 0dB 1020Hz, sine wave, MIC amp gain 0dB Tx_Vol 0dB, C-MESSAGE 1020Hz, sine wave Rx_Vol 0dB, C-MESSAGE 1020Hz, -10dBm0 typical MIC amp gain 0dB Tx_Vol 0dB, C-MESSAGE 1020Hz, -10dBm0 typical Rx_Vol 0dB, C-MESSAGE 1020Hz, 0dBm0 at transmission MIC amp gain 0dB Tx_Vol 0dB dB dB dB Transmitter Transmission Loss F Special MICINDSPOUT dB Receiver Transmission Loss F Special DSPINRECP dB 1020Hz, 0dBm0 at input Rx_Vol 0dB Noise during transmission Noise during reception idle idle 3.78kHz MICIN DSPOUT DSPIN REC[P-N] MICIN REC[P-N] 6.5 -65 -75 dBm0 dBV MIC amp gain 0dB Tx_Vol 0dB, C-MESSAGE DSPIN ALL0 Rx_Vol 0dB, C-MESSAGE 1020Hz, 0dBm0 at transmission MIC amp gain 0dB DSPIN ALL0 Tx_Vol 0dB Rx_Vol 0dB ST_MT OFF 1020Hz, 0dBm0 at input, 2040Hz component MIC amp gain 30dB Tx_Vol 0dB Rx_Vol 0dB ST_MT ON 1020Hz, sine wave, 0dBm0 at input Rx_Vol 0dB Crosstalk (TransmitterReceiver) 60 70 dB Crosstalk (ReceiverTransmitter) RX Higher Component Harmonic DSPIN DSPOUT Distortion 2nd to 5th time 63 68 dB 40 50 dB Pass Switch Block Parameter 1 Mute Level 2 Min. 70 Typ. 80 Max. Unit dB 70 80 dB Conditions Configured at each mute SW Measured at 1kHz BPF Configured at each mute SW Leakage amount to each test line during normal usage Measured at 1kHz BPF Receiving side is muted digitally by VIC_MT and SPVIC_MT. 1 MIC_SEL, MIC_MT, EXTIN_MT, MEL_MT, VIC_MT, REC_MT, ST_MT, HSJL_MT, HSJR_MT, SPVIC_MT, SPMEL_VOL, EXTOUT_SEL, TONE_MT, SOUND_MT, DIG_MT, AIN_MT, HP_SMT, SPOUT_SMT, EXTOUT_SMT, REC_SMT, HPR_MT, HPL_MT 2 Tx_test1, Tx_test2, Rx_test1, Rx_test2, REC_TST, HPR_TST, HPL_TST DTMF/TONE Generator Block Item Symbol VDTMF_L VDTMF_H Output Level VTONE_L VTONE_H Tone Distortion Microphone Bias Block Parameter Output Voltage Maximum Output Current Load Stability Output Noise Voltage SDTN -15.3 -12.8 -14.3 -11.8 -13.3 -10.8 -38 dBV dBV dB Min. -15.3 -12.8 Typ. -14.3 -11.8 Max. -13.3 -10.8 Unit dBV dBV Conditions fDTMF_L TONERECP MEL_Vol 0dB Rx_Vol 0dB fDTMF_H TONERECP MEL_Vol 0dB Rx_Vol 0dB f: designated TONE, low band TONERECP MEL_Vol 0dB Rx_Vol 0dB f: designated TONE, high band TONERECP MEL_Vol 0dB Rx_Vol 0dB f=1kHz ( designated TONE) TONEREC[P-N] MEL_Vol 0dB Rx_Vol 0dB C-Message Symbol VO IO VO1 N Min. 1.8 2 Typ. 2.0 14.0 -109 Max. 2.2 30 -90 Unit V mA mV dBV Conditions Io=500A Io=100A2mA C-Message Io=500A 4/12 Reference Data 19 2.0 1.0 0.8 Stand-by Current [uA] 18 Circuit Current[mA] Vdd=3.4V 1.5 Vdd=3.4V Gain [dB] 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 17 Vdd=3.0V 16 1.0 Vdd=3.0V Lch 15 Vdd=2.6V 0.5 Vdd=2.6V Rch -0.8 -1.0 14 -50 0 50 100 Temperature[] 0.0 -50 0 50 100 Temperature [] 0 5000 10000 15000 20000 Frequency [Hz] Fig.1 Operational Current (All On) -40 Fig.2 Static Consumed Current Fig.3 16bit D/A Converter Frequency Characteristics @ 0dBFS 0 -20 -40 0 -20 -40 -50 THD+N [dB] -60 Lch LEVEL [dBV] LEVEL [dBV] -60 -80 -100 -120 -60 -80 -100 -120 -140 -70 Rch -80 -90 -60 -40 -20 0 -140 0 5000 10000 15000 20000 Frequency [Hz] 0 5000 10000 15000 20000 DAC Output Level [dBFS] Frequency [Hz] Fig.4 16bit D/A Converter Distortion @ 1kHz 2 0 2 0 Bass Boost Gain [dB] Fig.5 16bit D/A Converter FFT @ 0dBFS, 1kHz Fig.6 16bit D/A Converter FFT @ 0FS 10 6dB 8dB TX Gain [dB] 0 -10 -20 -30 -40 -50 -60 Bass Boost Gain [dB] -2 -4 -6 -8 -10 -12 -14 -16 10 100 1000 Frequency [Hz] 2dB 4dB 6dB 8dB 10dB 12dB 14dB 10000 100000 -2 4dB -4 2dB -6 -8 -10 -12 -14 -16 10 100 1000 10000 10dB 12dB 14dB 100000 0 1000 2000 3000 4000 Frequency [Hz] Frequency [Hz] Fig.7 Bus Boost Frequency Characteristics Fig.8 Bus Boost + High Pass Emphasis Frequency Characteristics 0 -10 -20 THD+N [dB] THD+N [dB] Fig.9 Voice CODEC TX Frequency Characteristics 0 -10 -20 -30 -40 -50 -60 -70 -80 2 0 -2 RX Gain [dB] -4 -6 -8 -10 -12 0 1000 2000 3000 4000 Frequency [Hz] -30 -40 -50 -60 -70 -80 0 10 20 30 40 50 Output Power [mW] 0 20 40 60 80 100 Output Power [mW] Fig.10 Voice CODEC RX Frequency Characteristics Fig.11 Headphone Amp Output Characteristics @ vdd=3.0V, 1kHz Fig.12 Receiver Amp Output Characteristics @ vdd=3.0V, 1kHz 5/12 Block Diagrams AUDCLK AUDTXD AUDRXD AUDCS TXCOM RXCOM PVCOM COMIN SMUTE DVDD DVSS AVSS PVDD AVDD PVSS CPOP POP BPF DSPCLK DSPIN Tx_testline MICB_1 MICB_2 MICO MICIN_C MICIN_1 MICIN_2 MIC_BIAS MIC BIAS RSTB CPU I/F 100k MIC_MT 100k + 27k RX_TEST1 VREF/COMMON VDD/VSS SMUTE 16step + MIC_SEL TX_TEST1 TX_VOL +6-8dB A/D EXTIN EXTIN_MT EXTGND 330k EXTOUT DSPOUT DSP I/F 8step Rx_testline EXTOUT EXTOUT_SMT TX_TEST2 ST_VOL 60k 60k ST_MT -18-42dB 100k 100k REC_MT + 100k REC_TST 100k 32step Gain=3.2dB + RECN RX_VOL 0-30dB D/A 41.7k VIC_MT 32step +6-54dB MEL_VOL RX_TEST2 LPF PLLLPF PLL FSYNC 40k + 40k TONE_MT DTMF/ TONE RECP + REC_SMT 60k MEL_MT 100k Gain=3.2dB 60k 32step + 41.7k SPVIC_MT 16step +6-8dB SPMEL_VOL SPOUT SPOUT_SMT SPRX_VOL 60k SPMEL_MT SOUND_MT 0-30dB 16step 0-28dB AIN_R 50k AIN_MT HPR_TST 80k HPL_TST 200k 100k 100k + Gain=+3dB 70.8k HSJL_MT 32step 0-45dB 8step +140dB Gain=+3dB 70.8k + 100k HPL_MT 80k 50k + AIN_VOL AIN_L 50k SYSCLK Digital Bass Boost SDI Digital I/F HP_LI 200k + HP_SMT + 100k HP2_VOL 25k 25k HP_L HP_R 16bit DAC 100k HSJR_MT HP_VOL 50k DIG_MT LRCLK 200k HP_RI 200k 100k HP2_VOL 8step +140dB HPR_MT + BCLK 25k 25k TEST Fig.13 BU7861KN Block Diagram AUDRXD AUDTXD AUDCS AUDCLK DACLO DACRO CSTEP PLLLPF PVDD 36 35 34 33 32 31 30 29 28 27 26 25 24 DSPIN RECN 37 23 DSPOUT RECP 38 22 DSPCLK CSTEP 39 21 DVSS CPOP 40 20 DVDD SMUTE 41 FSYNC 19 SYSCLK 18 BCLK 17 SDI 16 LRCLK 15 RSTB 14 TEST 13 DACRO DACLO 12 HP_R HP_RI HP_LI HP_L RXCOM42 BU7861KN TXCOM43 PVCOM 44 COMIN 45 46 EXTOUT MICB_1 47 MICB_2 48 MICIN_C MICIN_1 MICIN_2 EXTGND SPOUT 1 MICO 2 3 4 5 6 EXTIN 7 AVDD 8 AVSS 9 10 AIN_L 11 AIN_R Fig.14 BU7861KN Pin Placement Diagram 6/12 PVSS Lowpass Correction Circuit The headphone output terminal (either HP_X or HPX_OUT) has a built-in "lowpass correction circuit" to correct lowpass decay, comprised of output coupling capacity and headphone impedance. 200k 200k 100k + CL + HP_X or HPX_OUT RL CCHPx HP_XI or HPX_FB OUTPUT Fig.15 Headphone Output Section Equivalent Circuit Lowpass Cut-off Frequency Lowpass Boost Frequency Boost Gain fC= 1/(2CLRL) fBOOST = 1/(2CCHPx200k) ABOOST = 20log((200 k+1/(2fCCHPx))/100 k) (Maximum lowpass boost is 6dB.) The constant configuration calculates the lowpass cut-off frequency fC after confirming the output coupling capacity CL and headphone impedance RL used. CCHPx is determined in order for the lowpass cut-off frequency fC and lowpass boost frequency fBOOST to roughly correspond. The recommended constants are CL = 100F, when RL = 16 and CCHPx = 6800pF. The chart below shows the frequency characteristics (calculated values) during recommended constant use. 10 5 0 -5 -10 Gain [dB] After correction Amp Output -15 -20 -25 -30 -35 -40 1 10 100 Frequency [Hz] 1000 10000 100000 Before correction Fig.16 Low pass Correction Circuit Frequency Characteristics 7/12 Recommended Circuits CPU AVDD AVSS DVDD DVSS PVDD PVSS TXCOM RXCOM PVCOM COMIN AUDCLK AUDTXD AUDCS AUDRXD + RSTB SMUTE 1u 1u MICB_1 MICB_2 MICO MICIN_C MICIN_1 MIC_BIAS MIC BIAS CPU I/F VREF/COMMON 1u 1u VDD/VSS SMUTE POP MIC_MT + MICIN_2 EXTIN EXTIN_MT MIC_SEL 16step + TX_VOL TX_TEST1 A/D BPF DSPCLK DSPIN CPU +6-8dB RX_TEST1 Tx_testline Rx_testline EXTOUT EXTOUT TX_TEST2 DSP I/F CPOP 0.1u 1u + + + DSPOUT 8step ST_VOL ST_MT -18-42dB REC_MT RECN 32step RX_VOL Gain=3.2dB + D/A LPF PLLLPF 0.01u + REC_TST VIC_MT 32step +6-54dB MEL_VOL 0-30dB RX_TEST2 32 PLL FSYNC DTMF/ TONE RECP + MEL_MT Gain=3.2dB SPVIC_MT 32step SPRX_VOL 16step +6-8dB SPMEL_VOL + TONE_MT SPOUT 8 SP amp + SPMEL_MT SOUND_MT AIN_MT 0-30dB HPR_TST 16step 0-28dB AIN_R AIN_VOL AIN_L SYSCLK IC HPL_TST HP_LI 6800pF HSJL_MT 32step 0-45dB 16bit DAC Digital I/F 8step HPL_MT +140dB HSJR_MT + HP_VOL DIG_MT SDI Digital Bass Boost + + + + - HP2_VOL 16 + 100u HP_L HP_R LRCLK DSP + 16 100u 6800pF BCLK HP2_VOL + HP_RI 8step HPR_MT +140dB TEST CSTEP Fig.17 Recommended Circuit 8/12 DACLO DACRO 0.1u Input/output No equivalent circuit figure I/O Analog/Digital Terminal function Power source Circuit figure Terminal name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 MICO MICIN_C MICIN_1 MICIN_2 EXTGND EXTIN AVDD AVSS SPOUT AIN_L AIN_R DACLO DACRO TEST RSTB LRCLK SDI BCLK SYSCLK DVDD DVSS DSPCLK DSPOUT DSPIN FSYNC PLLLPF AUDCLK AUDCS AUDTXD AUDRXD PVSS HP_LI HP_L HP_R HP_RI PVDD RECN RECP CSTEP CPOP SMUTE RXCOM TXCOM PVCOM COMIN EXTOUT MICB_1 MICB_2 O O I I O I O I I I I I I I I I I I O I I O I I I O I O O I O O O O O O O O I O O O Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Analog Digital Digital Digital Digital Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog MIC output MIC Selection output MIC1 input MIC2 input External ground External input Power source for analog GND for analog Speaker output Melody input terminal Lch Melody input terminal Rch DAC Lch LPF Condenser connected terminal DAC Rch LPF Condenser connected terminal Please connect to DVSS L:Reset input LRCLK terminal 44.1kHz(fs) for DAC SDI terminal for DAC BCLK terminal 2.8224MHz(64fs) for DAC SYSCLK terminal 11.2896MHz(256fs) for DAC The power source for digital GND for digital PCMClock input for PCM signal PCMsignal input PCM signal input 8kHz The reference clock for PLL Condenser connected terminal for PLL CPU I/F clock input terminal The chip selection terminal for CPU I/F (H active) CPU I/FData input terminal CPU I/FData output terminal GND for Headphone and receiver Lch head phone amplifier revision terminal in low limits Lch Head phone amplifier output terminal Rch Head phone amplifier output terminal Rch head phone amplifier revision terminal in low limits Power source for Headphone and receiver Receiver output Receiver output Step noise decrease terminal when volume is variable Pop sound decrease terminal Constant terminal when soft mute Receiving standard voltage output Transmit standard voltage output PATH standard voltage output Standard voltage input terminal External output MIC BIAS output1 MIC BIAS output2 AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD PVDD PVDD PVDD PVDD PVDD PVDD PVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD AVDD E E E E E H I I E D D F F A A B A B B I I B C A B F A A A C I F E E F I E E F F F E E E G H E E 9/12 PAD PAD PAD A B C PAD PAD PAD D E F PAD PAD PAD G H I Fig.18 Terminal equivalent circuit figure 10/12 Operation Notes Absolute maximum ratings When applied voltage (VDD and VIN), and the operating temperature range (Topr) and the like it exceeds absolute maximum rating, there is a possibility of destroying, Because it cannot specify destructive mode such as short circuit or opening, when special mode which exceeds absolute maximum rating is supposed, that physical safety measure such as a fuse should be implemented. Recommendation operating range If it is this range, it is the range which almost can obtain the quality of according to expectation. Concerning electric quality being something which is guaranteed under condition of each item. Even inside the recommendation operating range, voltage, temperature characteristic is shown. About the opposite connection of the power source connector There is a possibility of destroying LSI with the opposite connection to the power source connector. Please administer the measure such as the diode is inserted between power source and the power source terminal of LSI outside as the protection for opposite connection destruction. About the power source line At the time of designing the baseplate pattern, as for wiring of the power source/GND line, please make sure to become low impedance. At that time, even digital type power source and analog type power source being the same electric potential, please separate digital type power source pattern and analog type power source pattern, control the turning of digital noise to the analog power source due to the common impedance of wiring pattern. Concerning the GND line, please consider the similar pattern design. In addition, concerning all power source terminals of LSI, the condenser is inserted between power source and the GND terminal, in the case of electrolysis condenser use, please decide constant with sufficient verification in regard to the fact of without being problem in qualities of the condenser which is used, such as the capacity pulling out happens in low temperature. About GND voltage As for electric potential of the GND terminal regarding what ever working condition, please make sure to become lowest electric potential. In addition, please really verify that does not have the terminal which becomes electric potential below GND include transient phenomenon About the short circuit between the terminal and error installing The occasion where you install in the set baseplate, please pay attention to the direction and the position gap of LSI sufficiently. when you install with mistake, there is a possibility of LSI destroying. In addition, there is a possibility of destruction concerning when it short-circuits e.g. due to the foreign material enters between the terminal and between terminal and power source and GND. About the operation in the strong electromagnetic field As for the use in the strong electromagnetic field, being to be a possibility of doing the malfunction, please note. About the testing with the set baseplate When inspecting with the set baseplate, the condenser is connected to the LSI terminal whose impedance is low, because there is a possibility of stress depending on LSI, please be sure to do discharge in every process. In addition, when installing and removing the tool in inspection process, by all means with power source as off to connect, to inspect, to remove. Furthermore, As a static electricity measure, please note to administer the earth and the conveyance and preservation in the case of assemble process sufficiently. About each input terminal With respect to the structure of LSI, the parasitic element is formed inevitably by the relationship of electric potential. It causes the interference of circuit operation due to the fact that the parasitic element operates, the malfunction, even can become cause of destruction. Therefore, e.g., the voltage which is lower than GND in the input terminal is impressed, please note sufficiently not to do the method where the parasitic element operates. In addition, When not impress power supply voltage in LSI, please do not impress voltage in the input terminal. Furthermore, when power supply voltage is impressed even, as for each input terminal, please make voltage below power supply voltage or within guaranteed performance of electric quality. About GND wiring pattern When there are both small signal GND and a heavy-current GND, it separates small signal GND pattern from heavy-current GND pattern, in order that the pattern wiring and the voltage change caused by large current do not change the voltage of small-signal GND, it is recommended to carry out the one-point grounding at the reference point of set.. Please be careful of not to fluctuate the GND wiring pattern of external parts When in the external condenser, the ceramic condenser is used, please decide the constant on the consideration of the nominal capacity decrease caused by direct current bias and the change of the capacity due to temperature etc. 11/12 Order type name selection B U 7 8 6 1 K N E 2 Rohm model name Model number Package type KN=UQFN Taping model E2= Reel type embossed tape UQFN48 7.2 0.1 7.0 0.1 (1.4) 36 37 25 24 0.6 +0.1 -0.3 7.2 0.1 7.0 0.1 Tape Quantity Direction of feed Embossed carrier tape(with dry pack) 2500pcs E2 (The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand) .5 (0 5) .4 (0 35) 48 1 12 13 0.20 0.05 0.4 0.05 0.02 -0.02 0.95MAX +0.03 (0 . 20 ) 1234 1234 1234 1234 1234 1234 0.22 0.05 0.05 (Unit:mm) Reel 1pin Direction of feed When you order , please order in times the amount of package quantity. Catalog No.08T818A '08.9 ROHM (c) Appendix Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright (c) 2009 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster @ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix-Rev4.0 |
Price & Availability of BU7861KN-E2
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |